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Liquid polystyrene: a room-temperature photocurable soft lithography compatible pour-and-cure-type polystyrene
Tobias M Nargang1, Lara Brockmann, Pavel Mitkov Nikolov
1Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany. bastian.rapp@kit.edu.
Researchers developed liquid polystyrene (PS) for microfluidic prototyping, enabling easy fabrication of PS devices. This innovation bridges the gap between prototyping and industrial microfluidics using a versatile, common material.
Area of Science:
- Microfluidics
- Materials Science
- Polymer Chemistry
Background:
- Polydimethylsiloxane (PDMS) is the dominant material in microfluidics due to soft lithography, but has limitations in solvent resistance and hydrophobicity.
- Polystyrene (PS) offers superior properties for certain applications like cell-based assays but is difficult to prototype with using traditional methods.
Purpose of the Study:
- To introduce a novel method for prototyping microfluidic devices using polystyrene (PS).
- To bridge the gap between microfluidic prototyping and industrial-scale manufacturing by utilizing a common material.
Main Methods:
- Development of a liquid PS prepolymer, termed "Liquid Polystyrene" (liqPS).
- Curing liqPS using visible light with soft replication templates (e.g., PDMS).
- Characterization of cured liqPS and comparison with commercial PS using cell-based assays (mouse fibroblasts L929).
Main Results:
- liqPS allows for microfluidic prototyping with PS using soft lithography, similar to PDMS.
- Cured liqPS is chemically and physically identical to commercial PS.
- Cell studies showed no discernible difference between liqPS and commercial PS devices.
Conclusions:
- liqPS provides a facile prototyping method for polystyrene microfluidic devices.
- This approach enables seamless transition from research prototyping to industrial manufacturing using the same material.
- liqPS expands material options in microfluidics, overcoming limitations of PDMS for specific applications.
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