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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
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Flexible and transparent metallic grid electrodes prepared by evaporative assembly
Jae Hoon Park1, Dong Yun Lee, Young-Hoon Kim
1SKKU Advanced Institute of Nanotechnology (SAINT), ‡School of Chemical Engineering, §School of Advanced Materials Science and Engineering, Sungkyunkwan University , Suwon 440-746, Republic of Korea.
ACS Applied Materials & Interfaces
|July 8, 2014
Summary
Researchers developed a new method for creating flexible transparent metallic grid electrodes using evaporative deposition. This technique enables the fabrication of high-performance electrodes for various organic electronic devices.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Flexible transparent electrodes are crucial for next-generation electronic devices.
- Traditional fabrication methods often face limitations in scalability and cost-effectiveness.
Purpose of the Study:
- To introduce a novel, scalable method for fabricating flexible transparent metallic grid electrodes.
- To optimize the electrode properties for high optical transmittance and low sheet resistance.
Main Methods:
- Evaporative deposition combined with flow-coating for polymer line patterning.
- Multi-step process involving metal evaporation, polymer patterning, etching, and removal.
- Systematic control of grid width and spacing through polymer solution concentration and blade movement.
Main Results:
- Fabrication of gold (Au) grid electrodes with 92% optical transmittance at 550 nm.
- Achieved a low sheet resistance of 97 Ω/sq.
- Demonstrated successful application in organic field-effect transistors (OFETs), organic light-emitting diodes (OLEDs), and organic solar cells (OSCs).
Conclusions:
- The proposed flow-coating evaporative deposition method is effective for producing high-quality flexible transparent metallic grid electrodes.
- The fabricated electrodes are suitable for integration into diverse organic electronic devices.
- This approach offers a promising pathway for advanced flexible electronics manufacturing.
