Surface and thickness profile measurement of a transparent film by three-wavelength vertical scanning interferometry
Optics Letters
|August 15, 2014
Abstract:
We have developed a novel areal film thickness and topography measurement method using three-wavelength interferometry. The method simultaneously estimates the profiles of the front and back surfaces and the thickness distribution of a transparent film by model-based separation of two overlapped signals in an interferogram. The validity of the proposed method is demonstrated using computer simulations and actual experiments.
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