Patterned adhesive enables construction of nonplanar three-dimensional paper microfluidic circuits

Brent Kalish1, Hideaki Tsutsui

  • 1Department of Mechanical Engineering, University of California, Riverside, Riverside, CA 92521, USA. htsutsui@engr.ucr.edu.

Lab on a Chip
|September 16, 2014
PubMed
Summary

Researchers developed 3D paper microfluidic circuits using spray adhesive and origami. This technique allows for foldable, reusable devices and enables new designs for paper analytical devices.

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