Related Experiment Video
Updated: Apr 23, 2026

Generating Lap Joints Via Friction Stir Spot Welding on DP780 Steel
Published on: August 13, 2019
Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis
M S Abdul Aziz1, M Z Abdullah1, C Y Khor1
1School of Mechanical Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia.
Abstract:
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183(°)C) < T < 643.15 K (370(°)C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.
Related Concept Videos
Thermal Strain
Thermal expansion and Thermal stress: Problem Solving
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55...
Thermal Stress
Temperature Dependent Deformation

