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Updated: Apr 21, 2026

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
Published on: September 2, 2015
Epidermal electronics with advanced capabilities in near-field communication
Jeonghyun Kim1, Anthony Banks, Huanyu Cheng
1Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA; Department of Materials Science and Engineering, Department of Energy Engineering, Hanyang University, Seoul, 133-791, Republic of Korea.
New epidermal electronics integrate stretchable coils and thin near field communication (NFC) chips for seamless skin contact. These devices enable reliable wireless communication with smartphones, even during physical activity and deformation.
Area of Science:
- Materials Science
- Electrical Engineering
- Biomedical Engineering
Background:
- Epidermal electronics offer a platform for wearable sensing and human-computer interfaces.
- Existing epidermal systems often face challenges with mechanical robustness and reliable wireless communication.
Purpose of the Study:
- To develop advanced epidermal electronics with enhanced near field communication (NFC) capabilities.
- To ensure seamless skin integration and robust wireless connectivity under various physical conditions.
Main Methods:
- Integration of stretchable coils and thinned NFC chips onto low-modulus stretchable adhesives.
- Design for conformal contact with the skin, accommodating extreme deformation.
Main Results:
- Demonstration of epidermal electronic systems with advanced NFC functionalities.
- Achieved seamless and conformal skin contact, enabling wireless interfaces with standard NFC-enabled smartphones.
- Maintained functionality during extreme deformation and normal daily activities.
Conclusions:
- The developed epidermal electronics provide a robust platform for wireless interfaces.
- These systems offer advanced NFC capabilities for wearable applications, even under dynamic conditions.
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