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Robust Ag nanoplate ink for flexible electronics packaging.

Ruo-Zhou Li1, Anming Hu, Denzel Bridges

  • 1School of Electronic Science and Engineering, Southeast University, Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing 210096, China. tzhang@seu.edu.cn.

Nanoscale
|April 1, 2015
PubMed
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This study presents a novel polyvinylpyrrolidone (PVP)-stabilized silver nanoplate ink for strong, low-temperature bonding. Photonic sintering significantly reduces the bonding temperature, enabling applications in printable electronics and microcircuits.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Electronics Engineering

Background:

  • Nanoinks are crucial for low-temperature bonding and printable electronics.
  • Developing robust bonding methods at lower temperatures is a key challenge.

Purpose of the Study:

  • To develop a polyvinylpyrrolidone (PVP)-stabilized silver (Ag) nanoplate ink for strong low-temperature packaging.
  • To investigate the relationship between bonding strength and electrical conductivity post-bonding.
  • To explore the efficacy of photonic sintering for reducing bonding temperatures.

Main Methods:

  • Development of a PVP-stabilized Ag nanoplate ink.
  • Analysis of bonding strength and electrical conductivity using techniques that observed PVP shell plastic deformations and PVP nanofibers.

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  • Photonic sintering and thermal sintering for comparison.
  • Numerical simulation of light-induced heat generation for sintering.

    • Main Results:

    • Low-temperature bonding (<250 °C) was primarily attributed to adhesive bonding, evidenced by PVP shell plastic deformations and nanofiber formation.
    • Photonic sintering achieved a ~70 °C reduction in transformation temperature from adhesive to metallic bonding compared to thermal sintering.
    • High bonding strengths of 27 MPa at room temperature and 29.4 MPa at 210 °C were achieved with photonic sintering.
    • Anisotropic resistivity with varying thermal dependencies was observed.

    Conclusions:

    • PVP-stabilized Ag nanoplate inks offer strong bonding capabilities at low temperatures.
    • Photonic sintering is an effective method for significantly reducing bonding temperatures.
    • These Ag nanoplate inks show great potential for low-temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and sensing applications.