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Thermal conductivity enhancement in thermal grease containing different CuO structures
Wei Yu1, Junchang Zhao2, Mingzhu Wang1
1College of Engineering, Shanghai Second Polytechnic University, 2360 Jin Hai Road, Pudong District,, Shanghai, 201209 China.
Nanoscale Research Letters
|April 9, 2015
Summary
Three cupric oxide (CuO) structures were synthesized and tested as thermal conductive fillers in silicone grease. CuO microdisks significantly enhanced thermal conductivity more than nanoblocks or microspheres due to their shape.
Area of Science:
- Materials Science
- Nanotechnology
- Chemical Engineering
Background:
- Cupric oxide (CuO) structures are of significant interest for diverse applications.
- Tailoring CuO morphology is crucial for optimizing its performance in composite materials.
Purpose of the Study:
- To synthesize and characterize three distinct CuO structures: microdisks, nanoblocks, and microspheres.
- To evaluate the efficacy of these CuO structures as thermal conductive fillers in silicone-based thermal greases.
- To investigate the influence of CuO morphology on the thermal conductivity enhancement of the greases.
Main Methods:
- Solution-based synthetic methods were employed to prepare CuO microdisks, nanoblocks, and microspheres.
- Field-emission scanning electron microscopy (FESEM) and X-ray diffractometry (XRD) were used for structural and morphological characterization.
- Silicone-based thermal greases were formulated with varying CuO structures at a 9 vol.% filler loading.
Main Results:
- The thermal conductivity of silicone grease increased by 139% (0.283 W/mK) with CuO microdisks, 116% (0.256 W/mK) with CuO nanoblocks, and 99% (0.239 W/mK) with CuO microspheres.
- A slight decrease in thermal conductivity was observed at elevated temperatures for all prepared greases.
- Experimental results were compared with Nan's model, highlighting the significant impact of the shape factor on thermal conductivity.
Conclusions:
- CuO microdisks, owing to their large aspect ratio, form more effective thermal networks, leading to superior thermal conductivity enhancement in silicone grease.
- The morphology of CuO fillers plays a critical role in determining the overall thermal performance of the composite material.
- These findings offer valuable insights for designing high-performance thermal interface materials using tailored nanostructures.
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