A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Area of Science:

• Mechanical Engineering
• Materials Science
• Nanotechnology

Background:

• Microelectronic packaging demands high-speed, precise manipulation.
• Existing wire clamping solutions may lack speed, accuracy, or robustness.

Purpose of the Study:

• To develop a novel monolithic piezoelectric actuated wire clamp.
• To achieve fast, accurate, and robust microelectronic device packaging.

Main Methods:

• Designed a compact, flexure-based structure with a two-stage amplification mechanism.
• Utilized pseudo-rigid-body and Lagrange modeling for kinematic, static, and dynamic analysis.
• Employed finite element analysis (FEA) and wire electro discharge machining for fabrication and evaluation.

Main Results:

• Achieved a displacement amplification ratio of 20.96 and a working mode frequency of 895 Hz.
• Demonstrated fast response and high accuracy with a motion resolution of 0.2 μm.
• Successfully performed high-speed precision grasping of gold and copper wires.

Conclusions:

• The monolithic piezoelectric wire clamp meets the requirements for advanced microelectronic packaging.
• The developed clamp exhibits excellent performance validated by theoretical calculations, FEA, and experimental tests.
• This technology enables precise and efficient handling of fine wires in microelectronic assembly.