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Measuring electro-mechanical properties of thin films on polymer substrates
Megan J Cordill1, O Glushko1, J Kreith2
1Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, 8700 Leoben, Austria.
Microelectronic Engineering
|June 18, 2015
Summary
Researchers studied thin copper films on polymer substrates under mechanical load. Combining electrical, imaging, and stress measurements reveals electromechanical behavior crucial for flexible electronics.
Area of Science:
- Materials Science
- Physics
- Engineering
Background:
- Advancing flexible electronics requires understanding thin metal films on polymer substrates under mechanical stress.
- Investigating film deformation, fracture, and stress during straining is critical for device reliability.
Purpose of the Study:
- To investigate the electromechanical and deformation behavior of metal films on polymer substrates.
- To combine electrical, surface imaging, and stress measurements for a comprehensive analysis.
Main Methods:
- In-situ four-point probe resistance measurements during straining.
- In-situ atomic force microscopy (AFM) for surface deformation and crack visualization.
- In-situ synchrotron tensile tests for stress-strain analysis.
Main Results:
- Quantified changes in electrical resistance with applied strain.
- Visualized localized thinning and crack initiation and propagation.
- Determined yield stress and stress relaxation during deformation.
Conclusions:
- The combined techniques provide a holistic understanding of electromechanical behavior in thin metal films.
- This knowledge is essential for the design and optimization of future flexible electronic devices.
- The study demonstrates the utility of integrated in-situ methods for materials characterization.
