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Published on: August 29, 2025
Few-layered titanium trisulfide (TiS3) field-effect transistors.
Alexey Lipatov1, Peter M Wilson, Mikhail Shekhirev
1Department of Chemistry, University of Nebraska - Lincoln, Lincoln, NE 68588, USA. sinitskii@unl.edu.
Few-layered titanium trisulfide (TiS3) field-effect transistors exhibit promising n-type electronic transport. Atomic layer deposition of alumina enhances TiS3 FET performance, showing potential for 2D electronic devices.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Titanium trisulfide (TiS3) is an emerging layered semiconductor with potential for electronic applications.
- Large, millimeter-long TiS3 whiskers can be synthesized via direct reaction of titanium and sulfur.
Purpose of the Study:
- To investigate the electronic properties of exfoliated few-layered TiS3 field-effect transistors (FETs).
- To explore the impact of atomic layer deposition (ALD) of alumina on TiS3 FET performance.
Main Methods:
- Exfoliation of TiS3 whiskers using the adhesive tape method.
- Fabrication of TiS3 field-effect transistors (FETs).
- Characterization of electronic transport properties before and after Al2O3 ALD.
Main Results:
- Exfoliated TiS3 FETs demonstrated n-type transport with mobilities of 18-24 cm(2) V(-1) s(-1) and ON/OFF ratios up to 300.
- ALD of Al2O3 on TiS3 FETs significantly improved performance, yielding mobilities up to 43 cm(2) V(-1) s(-1) and ON/OFF ratios up to 7000.
- Alumina ALD also led to substantial improvements in subthreshold swing characteristics.
Conclusions:
- TiS3 is a competitive 2D transition metal chalcogenide for electronic applications.
- ALD of alumina is a viable method to enhance the performance of TiS3-based devices.
- TiS3 holds promise for emerging device applications in nanotechnology and materials science.
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