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Combination of Universal Mechanical Testing Machine with Atomic Force Microscope for Materials Research
1National Engineering Research Center for Nanotechnology, Shanghai 200241, People's Republic of China.
Scientific Reports
|August 13, 2015
Summary
A new combined horizontal universal mechanical testing machine (HUMTM)-atomic force microscope (AFM) system enables detailed analysis of material deformation and fracture. This advanced tool overcomes limitations of existing systems for studying large-scale thin films.
Area of Science:
- Materials Science
- Mechanical Engineering
- Nanotechnology
Background:
- Understanding material deformation and fracture under external forces is crucial for materials development.
- Existing atomic force microscope (AFM)-combined tensile/compression devices have limitations in load force, specimen size, and strain rate capabilities.
Purpose of the Study:
- To develop and evaluate a novel combined horizontal universal mechanical testing machine (HUMTM)-atomic force microscope (AFM) system.
- To analyze the relationship between macroscopic mechanical properties, surface nanomorphology, and fracture processes in thin film materials.
Main Methods:
- Modification of a HUMTM to integrate with AFM, including a height-adjustable stabilizing apparatus.
- Evaluation of the combined HUMTM-AFM system's performance.
- Application to study polymer (Parafilm) and metal (aluminum foil) thin films under external force.
Main Results:
- The combined HUMTM-AFM system successfully analyzed macroscopic mechanical properties and surface nanomorphological changes.
- It demonstrated the ability to study materials with both high (polymer) and low (metal) strain rates.
- The system overcomes limitations of previous AFM-combined devices, such as small load force and inability to handle large specimens.
Conclusions:
- The developed combined HUMTM-AFM system is a versatile and promising tool for advanced materials research.
- It provides new capabilities for investigating material behavior at multiple scales.
- This technology facilitates a deeper understanding of deformation and fracture mechanisms in thin films.

