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Highly Sensitive, Encapsulated MoS2 Photodetector with Gate Controllable Gain and Speed
Dominik Kufer1, Gerasimos Konstantatos1
1ICFO-Institut de Ciencies Fotoniques, The Barcelona Institute of Science and Technology , Castelldefels, Barcelona 08860, Spain.
Nano Letters
|October 27, 2015
Summary
We developed stable, high-performance molybdenum disulfide (MoS2) photodetectors by encapsulating them with hafnium oxide. This protection enhances electronic properties and sensitivity, paving the way for advanced optoelectronic applications.
Area of Science:
- Materials Science
- Nanotechnology
- Optoelectronics
Background:
- Two-dimensional molybdenum disulfide (MoS2) shows promise for sensitive photodetection due to its thin profile and bandgap.
- Environmental adsorbates negatively impact MoS2 photodetector performance due to their high surface-to-volume ratio.
Purpose of the Study:
- To create stable, high-performance monolayer and bilayer MoS2 photodetectors.
- To investigate the effects of atomic layer deposited hafnium oxide encapsulation on MoS2 device properties.
Main Methods:
- Encapsulation of monolayer and bilayer MoS2 with atomic layer deposited hafnium oxide.
- Characterization of electronic properties, responsivity, and temporal response under varying gate voltages.
Main Results:
- Encapsulated MoS2 photodetectors exhibited enhanced stability and electronic properties, including n-type doping, reduced hysteresis, and lower resistance.
- Device responsivity (R) and temporal response (t) were tunable over several orders of magnitude (R ~ 10-10(4) A/W, t ~ 10 ms to 10 s).
- Record sensitivity (D* ≥ 7.7 × 10(11) Jones) was achieved at strong negative gate voltage with high-speed operation.
Conclusions:
- Atomic layer deposited hafnium oxide encapsulation effectively protects MoS2 from environmental degradation, leading to stable, high-performance photodetectors.
- Tunable optoelectronic properties and record sensitivity demonstrate the potential of encapsulated MoS2 for advanced applications.
- This work highlights the importance of encapsulation for transition metal dichalcogenide optoelectronics and enables future flexible device development.
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