Related Experiment Video
Updated: Mar 31, 2026

09:59
Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
8.3K
Total internal reflection optical switch using the reverse breakdown of a pn junction in silicon.
Optics Letters
|October 30, 2015
Summary
This study introduces a novel silicon optical switch using a pn junction as both reflector and heater. It achieves efficient light switching via plasma dispersion and thermo-optic effects, demonstrating practical device performance.
Area of Science:
- Photonics and Optical Engineering
- Semiconductor Devices
- Integrated Optics
Background:
- Total-internal-reflection (TIR) optical switches are crucial for optical communication networks.
- Existing silicon-based optical switches often face challenges with integration, efficiency, or complex fabrication.
- Developing compact and efficient silicon optical switches remains an active area of research.
Purpose of the Study:
- To demonstrate a novel silicon total-internal-reflection (TIR) optical switch.
- To utilize a simple pn junction for both optical reflection and thermal control.
- To achieve efficient light switching using plasma dispersion and thermo-optic effects.
Main Methods:
- Fabrication of a silicon optical switch with a pn junction integrated between asymmetrically y-branched multimode waveguides.
- Utilizing the plasma dispersion effect of pre-doped carriers for light reflection at rest.
- Employing the thermo-optic effect induced by reverse breakdown of the pn junction to switch light to transmission.
- Characterizing switching operation in a shallow TIR region (1 μm width) with a 6° branch angle.
Main Results:
- Successful demonstration of switching operation in the fabricated silicon optical switch.
- Achieved an extinction ratio of 12 dB.
- Measured an insertion loss of -4.2 dB.
- Required a thermal heating power of 151.5 mW for switching.
Conclusions:
- The proposed pn junction-based silicon optical switch effectively utilizes plasma dispersion and thermo-optic effects for light switching.
- The device demonstrates promising performance metrics, including a good extinction ratio and manageable insertion loss.
- This design offers a simple and potentially scalable solution for integrated silicon photonics applications.
Related Concept Videos
Diode: Reverse bias
2.6K
A diode is reverse-biased when the positive terminal of an external voltage source is connected to the n-type material and the negative terminal to the p-type material. This configuration opposes the natural direction of current flow through the diode, effectively increasing the width of the depletion region and the barrier potential. The reverse bias condition produces a minimal leakage current, primarily due to minority charge carriers. This leakage becomes significant when the reverse...
2.6K
P-N junction
1.7K
A p-n junction is formed when p-type and n-type semiconductor materials are joined together. At the interface of the p-n junction, holes from the p-side and electrons from the n-side begin to diffuse into the opposite sides due to the concentration gradient. This diffusion of carriers leads to a region around the junction where there are no free charge carriers, known as the depletion region. The charge density within the depletion region for the n-side and p-side can be described by the...
1.7K
Biasing of P-N Junction
2.5K
The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
2.5K
Biasing of Metal-Semiconductor Junctions
815
Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
815
Diode: Forward bias
2.8K
In semiconductor devices, diodes play a crucial role in directing current flow, and its operation is primarily categorized into forward bias and reverse bias. A diode is said to be forward-biased when its p-type region is connected to the positive terminal of a battery and its n-type region is linked to the negative terminal. This configuration reduces the potential barrier within the diode, allowing current to flow easily from the p to the n-type region.
The behavior of a diode in forward bias...
The behavior of a diode in forward bias...
2.8K
Metal-Semiconductor Junctions
1.3K
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
1.3K

