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Updated: Mar 24, 2026

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Lawrence H Friedman1, Mark D Vaudin1, Stephan J Stranick1
1Materials Measurement Science Division, National Institute of Standards and Technology, Gaithersburg, MD 20899, USA.
Electron backscatter diffraction (EBSD) accurately maps small-scale strain fields, while confocal Raman microscopy (CRM) shows similar precision but lower accuracy. Both techniques are validated against finite element analysis (FEA) models for indentation deformation.
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