High-throughput bend-strengths of ultra-small polysilicon MEMS components

The strength distribution of polysilicon bend specimens, approximately 10 $\text{microm}$ in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporated into a stochastic extreme-value strength framework. Agreement between experiment and prediction suggest that the ultra-small specimens may be at the limit of extreme-value scaling and contain only one strength-controlling flaw/specimen.