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Effects of Titanium Layer Oxygen Scavenging on the High-k/InGaAs Interface
Roy Winter1, Pini Shekhter1, Kechao Tang2
1Department of Materials Science and Engineering, Technion-Israel Institute of Technology , Haifa 3200003, Israel.
ACS Applied Materials & Interfaces
|June 11, 2016
Summary
Adding thin titanium (Ti) layers to high-k/InGaAs gate stacks effectively removes oxygen from the interface. This remote oxygen scavenging using Ti can reduce interface traps in nanoelectronic devices.
Area of Science:
- Materials Science
- Semiconductor Physics
- Nanoelectronics
Background:
- Passivating high-k/InGaAs interfaces is crucial for advanced nanoelectronics.
- High defect densities at these interfaces hinder device performance.
Purpose of the Study:
- To investigate the oxygen scavenging effect of thin titanium (Ti) layers on high-k/InGaAs gate stacks.
- To understand how Ti influences the passivation of InGaAs native oxides.
Main Methods:
- Utilized synchrotron X-ray photoelectron spectroscopy (XPS) with in situ metal deposition.
- Performed electrical characterization using capacitance-voltage (C-V) and conductance-voltage (G-V) measurements.
- Analyzed Pt/Ti/Al2O3/InGaAs and Pt/Al2O3/InGaAs capacitor structures before and after annealing.
Main Results:
- Observed remote oxygen removal from the InGaAs native oxide through Al2O3 and HfO2 layers via Ti's scavenging effect.
- XPS confirmed a decrease in InOx features after Ti deposition and further reduction post-annealing.
- Ti 2p spectra indicated oxidation of the Ti layer during XPS measurements.
Conclusions:
- Thin Ti layers act as effective remote oxygen scavengers in high-k/InGaAs gate stacks.
- This remote oxygen scavenging influences the density of interface traps at the high-k/InGaAs interface.
- The findings offer a pathway to improved passivation for InGaAs-based nanoelectronic devices.

