Heterogeneously Assembled Metamaterials and Metadevices via 3D Modular Transfer Printing

Seungwoo Lee1, Byungsoo Kang2, Hohyun Keum3

  • 1SKKU Advanced Institute of Nanotechnology (SAINT) &School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.

Scientific Reports
|June 11, 2016
PubMed

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