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Fabrication of Spatially Confined Complex Oxides
Published on: July 1, 2013
Remote Plasma Oxidation and Atomic Layer Etching of MoS2
Hui Zhu1, Xiaoye Qin1, Lanxia Cheng1
1Department of Materials Science and Engineering, University of Texas at Dallas , Richardson, Texas 75080, United States.
Exfoliated molybdenum disulfide (MoS2) oxidizes layer-by-layer with remote O2 plasma, enabling controlled surface functionalization and thinning for MoS2 device fabrication. Annealing removes the oxide layer, restoring the pristine MoS2 structure.
Area of Science:
- Materials Science
- Surface Chemistry
- Nanotechnology
Background:
- Molybdenum disulfide (MoS2) is a promising 2D material with unique electronic properties.
- Controlled surface modification of MoS2 is crucial for its integration into electronic devices.
- Understanding oxidation mechanisms is key to preventing degradation and enabling functionalization.
Purpose of the Study:
- To investigate the chemical oxidation of exfoliated MoS2 using remote O2 plasma.
- To characterize the surface changes, structural integrity, and chemical composition during oxidation.
- To explore the potential of remote O2 plasma for MoS2 surface functionalization and controlled thinning.
Main Methods:
- Remote O2 plasma exposure at varying durations and temperatures.
- Surface characterization using X-ray photoelectron spectroscopy (XPS).
- Structural and topographical analysis via low energy electron diffraction (LEED) and atomic force microscopy (AFM).
- Scanning tunneling microscopy (STM) for detailed structural verification.
Main Results:
- Oxidation occurs in a layered manner, primarily affecting the topmost layer of MoS2.
- Formation of S-O bonds and MoOx (molybdenum oxide) layers observed.
- Uniform monolayer amorphous MoO3 forms after 5 min of plasma exposure at 200 °C.
- Annealing at 500 °C effectively removes the MoO3 layer, restoring the ordered MoS2 structure.
Conclusions:
- Remote O2 plasma provides a controllable method for MoS2 surface oxidation.
- This process allows for surface functionalization and precise thinning of MoS2 layers.
- The ability to remove the oxide layer makes it suitable for MoS2 device fabrication processes.
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