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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
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A three-dimensional metal grid mesh as a practical alternative to ITO
Sungwoo Jang1, Woo-Bin Jung, Cheolgyu Kim
1Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea. heetae@kaist.ac.kr.
Nanoscale
|July 13, 2016
Summary
Researchers developed a novel 3D metal grid mesh as a flexible alternative to indium tin oxide (ITO). This new transparent electrode offers excellent optoelectronic performance and high stretchability for advanced flexible optoelectronics.
Area of Science:
- Materials Science
- Optoelectronics
- Nanotechnology
Background:
- Indium tin oxide (ITO) is the standard transparent electrode material but faces limitations in flexible applications.
- Existing alternatives struggle to meet all essential requirements for practical flexible optoelectronics.
- There is a critical need for a robust and high-performance transparent electrode for emerging flexible devices.
Purpose of the Study:
- To develop a practical and high-performance alternative to ITO for flexible optoelectronics.
- To engineer a substrate-embedded three-dimensional (3D) metal grid mesh with superior properties.
- To demonstrate the suitability of the new transparent electrode for real-world applications.
Main Methods:
- Fabrication of a large-area, substrate-embedded tall and thin 3D metal grid mesh using secondary sputtering.
- Characterization of optoelectronic performance, including sheet resistance and transmittance.
- Evaluation of mechanical properties such as stretchability and adhesion to polymer substrates.
- Assessment of surface morphology and haze levels.
Main Results:
- Achieved excellent optoelectronic performance: 9.8 Ω□(-1) sheet resistance and 85.2% transmittance.
- Demonstrated high stretchability with minimal resistance change for strains <15%.
- Obtained a sub-micrometer mesh period, a flat surface (RMS roughness ~5 nm), and low haze (~0.5%).
- Confirmed strong adhesion to polymer substrates, passing a tape test.
Conclusions:
- The substrate-embedded 3D metal grid mesh offers a promising, practical alternative to ITO for flexible optoelectronics.
- The unique 3D structure enables high aspect ratio, high resolution, and large-area fabrication via a simple process.
- The developed transparent electrode is suitable for practical applications, as evidenced by its successful testing in a flexible touch screen panel.
- This approach opens new avenues for wearable electronics and other flexible devices.

