Related Experiment Video
Updated: Mar 17, 2026

Expanding Nanopatterned Substrates Using Stitch Technique for Nanotopographical Modulation of Cell Behavior
Published on: December 8, 2016
Multilayer deformation planarization by substrate pit suturing
Abstract:
In the pursuit of 1064 nm high-power laser resistance dielectric coatings in the nanosecond region, a group of HfO2/SiO2 high reflectors with and without suture layers were prepared on prearranged fused silica substrates with femtosecond laser pits. Surface morphology, global coating stress, and high-resolution cross sections were characterized to determine the effects of substrate pit suturing. Laser-induced damage resistance was investigated for samples with and without suture layers. Our results indicate considerable stability in terms of the nanosecond 1064 nm laser-induced damage threshold for samples having a suture layer, due to decreased electronic field (e-field) deformation with simultaneous elimination of internal cracks. In addition, a suture layer formed by plasma ion-assisted deposition could effectively improve global mechanical stress of the coatings. By effectively reducing the multilayer deformation using a suture layer, electron-beam high-reflective coatings, whose laser-induced damage resistance was not influenced by the substrate pit, can be prepared.
Related Concept Videos
Transformation of Plane Strain
Under plane strain conditions, typical for members where one dimension significantly exceeds the others, deformations and resultant strains are...
Three-Dimensional Analysis of Strain
Plastic Deformations of Members with a Single Plane of Symmetry

