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Updated: Mar 16, 2026

Determination of Aggregate Surface Morphology at the Interfacial Transition Zone ITZ
Published on: December 16, 2019
Surface topography analysis with application of roughness area dependence method.
Adam Szyszka1, Mateusz Wośko1, Tomasz Szymański1
1Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Janiszewskiego 11/17, 50-372 Wroclaw, Poland.
This study introduces a new surface analysis method that overcomes the limitations of root mean square roughness (Rq). The technique provides more detailed surface property insights by analyzing roughness across varying sampling areas, enhancing material characterization.
Area of Science:
- Materials Science
- Surface Science
- Nanotechnology
Background:
- Root mean square roughness (Rq) is a standard but limited parameter for surface characterization.
- Rq uses only height variations, providing a single, often insufficient, descriptor of surface properties.
Purpose of the Study:
- To develop an advanced surface analysis method overcoming Rq limitations.
- To extract more comprehensive surface property information using roughness dependence on sampling area.
- To investigate the impact of growth parameters on semiconductor surfaces.
Main Methods:
- Developed a method calculating roughness as a function of increasing sampling area dimensions.
- Utilized Atomic Force Microscopy (AFM) to obtain surface topography data.
- Analyzed roughness area dependence plots for Gallium Nitride (GaN) and Aluminum Gallium Nitride/Gallium Nitride (AlGaN/GaN) heterostructures.
Main Results:
- Demonstrated that Rq dependence on sampling area provides richer surface information than a single Rq value.
- Successfully characterized surface properties of GaN and AlGaN/GaN heterostructures grown via Metal Organic Chemical Vapor Deposition (MOVPE).
- Showcased the method's applicability across different substrates (sapphire, silicon) and scale ranges.
Conclusions:
- The proposed surface analysis method offers a more detailed understanding of surface properties.
- This technique enhances the characterization of semiconductor materials and heterostructures.
- The method is versatile and applicable to various topography imaging techniques and scale ranges.
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