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A New Model for Temperature Jump at a Fluid-Solid Interface
Jian-Jun Shu1, Ji Bin Melvin Teo1, Weng Kong Chan1
1School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore.
Abstract:
The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature.
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