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CIGS thin-film solar module processing: case of high-speed laser scribing
Paulius Gečys1, Edgaras Markauskas1, Shiro Nishiwaki2
1Center for Physical Sciences and Technology, Savanoriu Ave. 231, LT-02300, Vilnius, Lithuania.
Scientific Reports
|January 14, 2017
Summary
High-speed laser scribing of copper indium gallium selenide (CIGS) thin-film solar cells was optimized. Top-contact layer lift-off processing achieved 50 m/s scribing speeds with minimal device degradation, crucial for terawatt-scale production.
Area of Science:
- Photovoltaics
- Materials Science
- Laser Processing
Background:
- Copper Indium Gallium Selenide (CIGS) thin-film solar cells are a key technology in renewable energy.
- High-speed manufacturing processes are essential for scaling up photovoltaic production.
Purpose of the Study:
- To investigate ultra-short pulsed laser scribing of CIGS solar cells at high speeds.
- To evaluate different P3 scribing approaches and their impact on device performance.
- To identify reliable methods for terawatt-scale CIGS solar cell manufacturing.
Main Methods:
- Utilized an ultra-short pulsed laser with a 1 MHz repetition rate.
- Investigated two P3 scribing methods: full layer ablation and front-contact removal.
- Evaluated scribe quality using Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS).
- Performed electrical measurements and device electrical behavior modeling at the mini-module scale.
Main Results:
- High-speed laser processing at high pulse repetition rates induced thermal damage.
- Top-contact layer lift-off processing achieved 1.7 m/s scribing speed with minimal degradation.
- Ultra-high speed P3 processing reached scribing speeds of 50 m/s.
- Mini-module scribing tests confirmed the viability of selected laser processes.
Conclusions:
- Top-contact layer lift-off is the only reliable method for high-speed P3 laser scribing of CIGS solar cells.
- This technique is suitable for future terawatt-scale photovoltaic production.
- Optimized laser parameters are critical to minimize thermal damage during high-speed processing.

