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Flexible All-Inorganic Perovskite CsPbBr3 Nonvolatile Memory Device.
Dongjue Liu1, Qiqi Lin1, Zhigang Zang1
1Key Laboratory of Optoelectronic Technology and Systems of the Education Ministry of China, College of Optoelectronic Engineering, Chongqing University , Chongqing 400044, China.
ACS Applied Materials & Interfaces
|January 24, 2017
Summary
Researchers developed flexible nonvolatile memory using low-temperature CsPbBr3 perovskite films. This breakthrough enables reliable resistive switching and endurance for future stable flexible electronic devices.
Area of Science:
- Materials Science
- Solid-State Physics
- Device Engineering
Background:
- All-inorganic perovskite CsPbX3 materials are vital for photoelectric devices like solar cells and LEDs.
- Flexible applications of CsPbX3 are limited by low-temperature fabrication challenges.
Purpose of the Study:
- To fabricate flexible CsPbBr3 perovskite films at low temperatures for nonvolatile memory applications.
- To investigate the resistive switching characteristics and reliability of these flexible devices.
Main Methods:
- A two-step method was used to fabricate CsPbBr3 films at 75 °C.
- The films were integrated into an Al/CsPbBr3/PEDOT:PSS/ITO/PET device structure.
- Resistive switching operations, endurance tests, and bending tests were performed.
Main Results:
- Highly crystallized CsPbBr3 films were successfully prepared at a low temperature of 75 °C.
- The flexible memory devices exhibited reproducible and reliable resistive switching characteristics and good endurance.
- The devices demonstrated electrical reliability and mechanical stability under various bending conditions.
Conclusions:
- Low-temperature fabrication of CsPbBr3 perovskite films is feasible for flexible nonvolatile memory.
- The proposed filament formation/rupture model explains the resistive switching mechanism.
- This work paves the way for designing stable, flexible perovskite-based electronic devices.
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