Highly Sensitive, Flexible MEMS Based Pressure Sensor with Photoresist Insulation Layer.

Area of Science:

• Materials Science
• Electronics Engineering
• Nanotechnology

Background:

• Flexible and wearable electronics require advanced pressure sensors for applications like artificial skin and health monitoring.
• Current pressure sensor fabrication is often complex, hindering integration with traditional silicon-based Micro-Electro-Mechanical Systems (MEMS).
• There is a need for pressure sensors that are sensitive, responsive, and easily manufacturable.

Purpose of the Study:

• To develop a scalable and integratable pressure sensor.
• To utilize a carbon nanotube conductive network and a photoresist insulation layer for contact resistance-based sensing.
• To achieve high performance metrics including sensitivity, low threshold, and fast response time.

Main Methods:

• Fabrication of a contact resistance-based pressure sensor.
• Utilizing a carbon nanotube conductive network as the sensing material.
• Employing a photoresist layer with tunable hole diameter and thickness for insulation and performance modulation.

Main Results:

• Achieved high sensitivity of 95.5 kPa^-1.
• Demonstrated a low sensing threshold of 16 Pa.
• Exhibited a fast response speed (<16 ms) and zero power consumption at rest.
• Showcased tunable sensitivity, sensing threshold, and dynamic range by adjusting insulation layer parameters.

Conclusions:

• The developed pressure sensor is scalable and integratable with MEMS technology.
• The sensor exhibits excellent performance characteristics suitable for advanced electronic applications.
• The tunable nature of the sensor design allows for customization for specific pressure sensing requirements.