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Updated: Feb 20, 2026

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
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Intermetallic compounds in 3D integrated circuits technology: a brief review

Syahira Annuar1, Reza Mahmoodian1,2,3, Mohd Hamdi1,2

  • 1Centre for advanced manufacturing and materials processing (AMMP), Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia.

Science and Technology of Advanced Materials
|October 24, 2017
PubMed

Keywords:
106 Metallic materials201 Electronics / Semiconductor / TCOs302 Crystallization / Heat treatment / Crystal growth3D-ICs40 Optical, magnetic and electronic device materials501 Chemical analysesIMCsPb-free solder jointlow-volume solder microbumpsmicrobumps

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