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3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

Sho Asano1, Masanori Muroyama2, Takahiro Nakayama3

  • 1Department of Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi 980-8579, Japan. asano@mems.mech.tohoku.ac.jp.

Sensors (Basel, Switzerland)
|October 26, 2017
PubMed

Keywords:
3-axis tactile sensorAu-Au thermo-compression bondingMEMS-CMOS integrationcapacitive sensorlow temperature cofired ceramic

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