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3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer.

Sho Asano1, Masanori Muroyama2, Takahiro Nakayama3

  • 1Department of Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi 980-8579, Japan. asano@mems.mech.tohoku.ac.jp.

Sensors (Basel, Switzerland)
|October 26, 2017
PubMed
Summary

This study presents a compact, 3-axis tactile sensor using complementary metal-oxide semiconductor (CMOS) and low-temperature co-fired ceramic (LTCC) technology. The novel sensor achieves high sensitivity for detecting forces in multiple directions, crucial for advanced robotics and human-machine interfaces.

Keywords:
3-axis tactile sensorAu-Au thermo-compression bondingMEMS-CMOS integrationcapacitive sensorlow temperature cofired ceramic

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Area of Science:

  • Microelectromechanical systems (MEMS)
  • Sensor Technology
  • Robotics

Background:

  • Tactile sensing is crucial for robots to interact with their environment.
  • Existing sensors often lack multi-axis capability or are too bulky.
  • Integrated solutions are needed for compact and efficient robotic systems.

Purpose of the Study:

  • To develop a fully integrated, 3-axis differential capacitive tactile sensor.
  • To demonstrate surface-mount capability on a bus line for easy integration.
  • To achieve high sensitivity and low noise for accurate force detection.

Main Methods:

  • Utilized flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits.
  • Employed low-temperature co-fired ceramic (LTCC) interposer with gold (Au) through vias.
  • Integrated Au bumps and a sealing frame for electrical connections and differential capacitive gap formation.
  • Fabricated a diaphragm within the CMOS substrate for 3-axis force sensing.

Main Results:

  • Achieved high sensitivity: >34 Count/mN (normal force), 14-15 Count/mN (shear force).
  • Demonstrated low noise performance (<1 mN).
  • Reported low hysteresis (<2% full scale) and average cross-sensitivity (11%).

Conclusions:

  • The developed sensor is a compact, highly sensitive, and integrated solution for 3-axis tactile sensing.
  • Its surface-mountable design and high performance make it suitable for advanced robotic applications.
  • This technology advances the field of tactile sensing for improved robotic manipulation and interaction.