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Thin Film Composite Silicon Elastomers for Cell Culture and Skin Applications: Manufacturing and Characterization
Published on: July 3, 2018
The influence of substrate roughness, patterning, curvature, and compliance in peeling problems
Lucas Brely1, Federico Bosia, Nicola M Pugno
1Department of Physics and 'Nanostructured Interfaces and Surfaces' Inter-Departmental Centre, Università di Torino, Via P. Giuria 1, 10125, Torino, Italy.
Abstract:
Biological adhesion, in particular the mechanisms by which animals and plants 'stick' to surfaces, has been widely studied in recent years, and some of the structural principles have been successfully applied to bioinspired adhesives. However, modelling of adhesion, such as in single or multiple peeling theories, has in most cases been limited to ideal cases, and due consideration of the role of substrate geometry and mechanical properties has been limited. In this paper, we propose a numerical model to evaluate these effects, including substrate roughness, patterning, curvature, and deformability. The approach is validated by comparing its predictions with classical thin film peeling theoretical results, and is then used to predict the effects of substrate properties. These results can provide deeper insight into experiments, and the developed model can be a useful tool to design and optimize artificial adhesives with tailor-made characteristics.
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