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Related Concept Videos

Properties of Transition Metals02:58

Properties of Transition Metals

30.1K
Transition metals are defined as those elements that have partially filled d orbitals. As shown in Figure 1, the d-block elements in groups 3–12 are transition elements. The f-block elements, also called inner transition metals (the lanthanides and actinides), also meet this criterion because the d orbital is partially occupied before the f orbitals.
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Phase Transitions02:31

Phase Transitions

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Whether solid, liquid, or gas, a substance's state depends on the order and arrangement of its particles (atoms, molecules, or ions). Particles in the solid pack closely together, generally in a pattern. The particles vibrate about their fixed positions but do not move or squeeze past their neighbors. In liquids, although the particles are closely spaced, they are randomly arranged. The position of the particles are not fixed—that is, they are free to move past their neighbors to...
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Cooperative Allosteric Transitions01:58

Cooperative Allosteric Transitions

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Cooperative allosteric transitions can occur in multimeric proteins, where each subunit of the protein has its own ligand-binding site. When a ligand binds to any of these subunits, it triggers a conformational change that affects the binding sites in the other subunits; this can change the affinity of the other sites for their respective ligands. The ability of the protein to change the shape of its binding site is attributed to the presence of a mix of flexible and stable segments in the...
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Protein-protein Interfaces02:04

Protein-protein Interfaces

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Many proteins form complexes to carry out their functions, making protein-protein interactions (PPIs) essential for an organism's survival. Most PPIs are stabilized by numerous weak noncovalent chemical forces. The physical shape of the interfaces determines the way two proteins interact. Many globular proteins have closely-matching shapes on their surfaces, which form a large number of weak bonds. Additionally, many PPIs occur between two helices or between a surface cleft and a...
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Bonding in Metals02:32

Bonding in Metals

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Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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Metallic Solids02:37

Metallic Solids

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Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
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Preparation of Liquid-exfoliated Transition Metal Dichalcogenide Nanosheets with Controlled Size and Thickness: A State of the Art Protocol
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Two-dimensional transition metal dichalcogenides: interface and defect engineering.

Zehua Hu1, Zhangting Wu, Cheng Han

  • 1Department of Chemistry, National University of Singapore, 3 Science Drive 3, Singapore 117543, Singapore. phycw@nus.edu.sg.

Chemical Society Reviews
|March 7, 2018
PubMed
Summary
This summary is machine-generated.

Interface and defect engineering of two-dimensional (2D) transition metal dichalcogenides (TMDCs) are crucial for next-generation nanoelectronics. Tailoring these aspects enhances TMDC properties for advanced electronic and optoelectronic devices.

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Nanotechnology

Background:

  • Two-dimensional (2D) transition metal dichalcogenides (TMDCs) are vital for next-generation nanoelectronics due to their unique properties.
  • Device performance in TMDCs is significantly influenced by interfaces (metal/TMDC, dielectric/TMDC) and intrinsic defects.

Purpose of the Study:

  • To review recent advances in interface and defect engineering of TMDCs.
  • To highlight applications of engineered TMDCs in electronic and optoelectronic devices.

Main Methods:

  • Overview of interface engineering strategies: surface charge transfer doping, TMDC/metal contact, and TMDC/dielectric interface modifications.
  • Introduction to various intrinsic defects in TMDCs (vacancies, adatoms, grain boundaries, impurities).
  • Summary of defect engineering strategies to modulate TMDC properties.

Main Results:

  • Engineered interfaces and defects can effectively modulate the electronic and optical properties of TMDCs.
  • Development of high-performance and functional electronic and optoelectronic devices utilizing these engineered TMDCs.
  • Demonstrated success in enhancing charge injection/collection and reducing charge carrier trapping.

Conclusions:

  • Interface and defect engineering are powerful tools for optimizing TMDC materials.
  • Significant opportunities exist for further advancements in TMDC-based electronics and optoelectronics through continued research.
  • Addressing challenges in interface and defect control is key to unlocking the full potential of TMDCs.