Understanding the Mechanism of SiC Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Developing Routes toward SiC
Ekaterina A Filatova1, Dennis Hausmann2, Simon D Elliott1
1Tyndall National Institute, University College Cork , Lee Maltings , Dyke Parade , Cork , T12R5CP , Ireland.
Abstract:
Understanding the mechanism of SiC chemical vapor deposition (CVD) is an important step in investigating the routes toward future atomic layer deposition (ALD) of SiC. The energetics of various silicon and carbon precursors reacting with bare and H-terminated 3C-SiC (011) are analyzed using ab initio density functional theory (DFT). Bare SiC is found to be reactive to silicon and carbon precursors, while H-terminated SiC is found to be not reactive with these precursors at 0 K. Furthermore, the reaction pathways of silane plasma fragments SiH3 and SiH2 are calculated along with the energetics for the methane plasma fragments CH3 and CH2. SiH3 and SiH2 fragments follow different mechanisms toward Si growth, of which the SiH3 mechanism is found to be more thermodynamically favorable. Moreover, both of the fragments were found to show selectivity toward the Si-H bond and not C-H bond of the surface. On the basis of this, a selective Si deposition process is suggested for silicon versus carbon-doped silicon oxide surfaces.
More Related Videos
09:45Epitaxial Growth of Perovskite Strontium Titanate on Germanium via Atomic Layer Deposition
Published on: July 26, 2016
12:05Preparation of Hydrophobic Metal-Organic Frameworks via Plasma Enhanced Chemical Vapor Deposition of Perfluoroalkanes for the Removal of Ammonia
Published on: October 10, 2013
Related Concept Videos
Phase Transitions: Sublimation and Deposition
The Atomic Theory of Matter
The Quantum-Mechanical Model of an Atom
Role of Microtubules in Cell Wall Deposition
Valence Bond Theory
Scientific Laws and Theories
