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Elastic strain engineering for ultralow mechanical dissipation.

A H Ghadimi1, S A Fedorov1, N J Engelsen1

  • 1Institute of Physics, École Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland.

Science (New York, N.Y.)
|April 14, 2018
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Summary
This summary is machine-generated.

Engineers achieved ultra-low mechanical dissipation in nanoscale devices by combining nanoscale stress with soft-clamping phononic engineering. This breakthrough enables highly coherent nanomechanical systems with record-high quality factors.

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Mechanical Engineering

Background:

  • Nanoscale structures can exhibit extreme stress, leading to enhanced material properties like high electron mobility in silicon transistors.
  • Mechanical dissipation in nanomechanical systems is a key factor limiting their performance and coherence.

Purpose of the Study:

  • To investigate the use of nanoscale stress combined with soft-clamping for reducing mechanical dissipation.
  • To engineer ultracoherent nanomechanical devices with exceptionally high quality factors.

Main Methods:

  • Fabrication of a free-standing silicon nitride nanobeam with a nonuniform phononic crystal pattern.
  • Colocalization of strain and flexural motion within the nanobeam.
  • Ringdown measurements at room temperature to characterize vibrational modes and quality factors.

Main Results:

  • Demonstration of string-like vibrational modes in the nanobeam.
  • Achieved quality (Q) factors as high as 800 million.
  • Observed Q × frequency products exceeding 10^15 hertz, indicating ultralow dissipation.

Conclusions:

  • Soft-clamping, a form of phononic engineering, effectively reduces mechanical dissipation when combined with nanoscale stress.
  • The engineered nanobeam exhibits properties suitable for ultracoherent nanomechanical devices.
  • This approach offers a promising pathway for developing advanced nanomechanical systems.