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Updated: Feb 12, 2026

Characterizing Dissipative Elastic Metamaterials Produced by Additive Manufacturing
Published on: June 28, 2024
Elastic strain engineering for ultralow mechanical dissipation
A H Ghadimi1, S A Fedorov1, N J Engelsen1
1Institute of Physics, École Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland.
Abstract:
Extreme stresses can be produced in nanoscale structures; this feature has been used to realize enhanced materials properties, such as the high mobility of silicon in modern transistors. We show how nanoscale stress can be used to realize exceptionally low mechanical dissipation when combined with "soft-clamping"-a form of phononic engineering. Specifically, using a nonuniform phononic crystal pattern, we colocalize the strain and flexural motion of a free-standing silicon nitride nanobeam. Ringdown measurements at room temperature reveal string-like vibrational modes with quality (Q) factors as high as 800 million and Q × frequency exceeding 1015 hertz. These results illustrate a promising route for engineering ultracoherent nanomechanical devices.
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