Scaling ultrashort laser pulse induced glass modifications for cleaving applications

Ultrashort laser pulses allow for in-volume processing of glass through non-linear absorption. This results in permanent material changes, largely independent of the processed glass, and it is of particular relevance for cleaving applications. In this paper, a laser with a wavelength of 1030 nm, pulse duration of 19 ps, repetition rate of 10 kHz, and burst regime consisting of either four or eight pulses, with an intra-burst pulse separation of 12.5 ns, is used. Subsequently, a Gaussian-Bessel focal line is generated in a fused silica substrate with the aid of an axicon configuration. We show how the structure of the modifications, including the length of material disruptions and affected zones, can be directly influenced by a reasonable choice of focus geometry, pulse energy, and burst regime. We achieve single-shot modifications with 2 μm in diameter and 7.6 mm in length, exceeding an aspect ratio of 1:3800. Furthermore, a maximum length of 10.8 mm could be achieved with a single shot.