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Updated: Jan 28, 2026

Measurement of X-ray Beam Coherence along Multiple Directions Using 2-D Checkerboard Phase Grating
Published on: October 11, 2016
Deep X-ray lithography system with a uniform and high-accuracy fabrication area established in beamline BL11 at
Masaya Takeuchi1, Akinobu Yamaguchi1, Yuichi Utsumi1
1Laboratory of Advanced Science and Technology for Industry, University of Hyogo, 3-1-2 Koto, Kamigori-cho, Ako-gun, Hyogo 678-1205, Japan.
Abstract:
A new lithography system to fabricate high-aspect-ratio 3D microstructures was developed at the NewSUBARU synchrotron radiation facility (University of Hyogo, Japan). The X-ray beam generated by this system has high parallelism (horizontal and vertical divergence angles of 278 µrad and 14 µrad, respectively) and high photon flux (31 mW mm-2 at a beam current of 300 mA). The high photon flux and exposure area of the system were validated and a beam-scan method for a large exposure area with a uniform dose distribution has been proposed. In addition, the deep X-ray lithography performance was characterized using a conventional photosensitive material and the synchrotron-radiation-induced direct etching of polytetrafluoroethylene (PTFE) was demonstrated. An enlargement of the microfabrication area up to 100 mm × 100 mm while contemporarily ensuring high uniformity was achieved.
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