Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Area of Science:

• Materials Science
• Thermal Engineering
• Electronics Packaging

Background:

• Effective heat dissipation is crucial for energy efficiency and performance in integrated electronics.
• Conventional heat sinks face limitations in advanced electronic devices.
• Novel micro-structuring techniques are needed for improved thermal management.

Purpose of the Study:

• To investigate the heat dissipation enhancement of micro-structured polymer-based flexible substrates coupled with aluminum-alloy heat sinks.
• To evaluate the effectiveness of laser surface texturing for thermal management in electronic applications.
• To analyze the impact of micro-structuring on light-emitting diode (LED) chip temperatures.

Main Methods:

• Infrared (IR) thermography to monitor temperature evolution of heat sinks under natural convection.
• Thermal transient measurements to assess heat dissipation performance.
• Finite Element Analysis (FEA) for detailed thermal modeling.
• Laser surface texturing for creating micro-structures on heat sinks.

Main Results:

• Micro-structured heat sinks demonstrated up to 25% enhancement in heat dissipation under natural convection.
• Laser-textured heat sinks resulted in a maximum LED chip temperature reduction of approximately 22.4% compared to as-received samples.
• FEA corroborated the experimental findings, confirming improved thermal performance.

Conclusions:

• Laser surface texturing of polymer-based flexible substrates coupled with aluminum-alloy heat sinks significantly improves heat dissipation.
• This micro-structuring approach offers a promising solution for on-chip thermal management in electronics.
• The simplicity of fabrication makes laser surface texturing a viable technique for practical applications.