Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future...

Area of Science:

• Materials Science
• Nanotechnology
• Electronics Engineering

Background:

• Advanced thermal management materials (TMMs) are critical for next-generation electronics, including flexible electronics and artificial intelligence (AI).
• Conventional TMMs struggle with complex thermal challenges like simultaneous overheating and overcooling in advanced electronic systems.

Purpose of the Study:

• To fabricate multifunctional TMMs with superior flexibility, durability, heat dissipation, and heating capabilities.
• To address the limitations of current TMMs in demanding electronic applications.

Main Methods:

• Fabrication of nacre-mimetic graphene-based films using a facile solution casting method.
• Characterization of film properties including flexibility, durability (over 10,000 tensile cycles), and thermal conductivity.
• Finite volume method simulations to demonstrate applications in flexible heat spreaders and film heaters.

Main Results:

• Achieved excellent thermal dissipation (20.84 W/(m·K)) at minimal thickness (16-22 μm).
• Demonstrated super flexibility and durability, withstanding over 10,000 tensile cycles.
• Exhibited outstanding heating performance for extreme cold conditions and high in-plane thermal conductivity.

Conclusions:

• The developed nacre-mimetic graphene films are superior multifunctional TMMs for electronic chip thermal management.
• High in-plane thermal conductivity is vital for effective thermal management in flexible heat spreaders and film heaters.
• These advanced TMMs are promising for future flexible electronics and AI technologies.