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Updated: Jan 25, 2026

Fused Filament Fabrication FFF of Metal-Ceramic Components
Published on: January 11, 2019
Bond strength of ceramics heat-pressed onto three dental alloys
Chun-Chuan Yang1, Yu-Ching Liu2, Min Yan3
1Lecturer, Department of Dental Technology, Shu-Zen Junior College of Medicine and Management, Kaohsiung, Taiwan, Republic of China; Doctoral student, Institute of Oral Sciences, Chung Shan Medical University, Taichung, Taiwan, Republic of China.
Statement Of Problem:
The press-on-metal (PoM) technique has been used as an alternative fabrication method for metal-ceramic restorations. However, how the PoM technique compares with the conventional porcelain layering (CPL) technique under a variety of conditions is unclear.
Purpose:
The purpose of this in vitro study was to compare the bond strength of 3 alloy substrates with heat-pressed ceramics or conventionally layered porcelain before and after thermocycling.
Material And Methods:
Specimens (n=5) of Au, Pd, and Ni-Cr alloys were veneered with heat-pressed ceramics or conventionally layered porcelain. The 3-point bend test was conducted according to the International Organization for Standardization standard 9693-1 as bond strength before and after thermocycling. The metal-ceramic interfaces were characterized by field emission scanning electron microscopy (FESEM) and energy dispersive X-ray spectroscopy (EDS). Two- and 3-way ANOVA followed by the Tukey honestly significant difference (HSD) test were used to analyze the data (α=.05).
Results:
Significantly lower mean bond strength was recorded for the Au and Pd alloys of the PoM group than for those of the CPL group (P<.05). CPL-Au demonstrated the highest bond strength of 50.2 ±2.0 MPa, whereas PoM-Pd showed the lowest bond strength of 31.8 ±2.7 MPa; significant differences were found among all groups (P<.05). After 20 000 thermocycles, CPL-Au showed significantly reduced bond strength value (P<.05). A value of approximately 40 MPa was observed in all groups except for PoM-Pd (26.5 ±1.6 MPa, P<.05). The metal-ceramic interface resulting from the PoM technique revealed 2- to 20-μm pores, with more defects observed in the PoM-Pd group than in any of the other group.
Conclusions:
Defects and an oxide layer were formed at the metal-ceramic interface during the heat-pressing process, especially for the Pd alloy. After thermocycling, PoM-Pd had the lowest bond strength value, although it exceeded the minimum 25 MPa of the ISO 9693-1 standard. The Au and Ni-Cr alloys exhibited similar levels of porcelain bond strength with both techniques.
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