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    Area of Science:

    • Photonics
    • Plasmonics
    • Materials Science

    Background:

    • Silicon photonics offers efficient light manipulation.
    • Hybrid-plasmonic waveguides combine advantages of plasmonics and dielectrics.
    • Efficient coupling between these platforms is crucial for integrated devices.

    Purpose of the Study:

    • To demonstrate a novel low-loss coupling scheme.
    • To achieve high coupling efficiency between silicon photonic and hybrid-plasmonic waveguides.
    • To develop a fabrication-tolerant coupler for CMOS compatibility.

    Main Methods:

    • Design and fabrication of a metal-insulator-semiconductor coupler.
    • Integration of silicon photonic and hybrid-plasmonic waveguides.
    • Measurement of coupling efficiency.

    Main Results:

    • Achieved coupling efficiencies up to 94% (-0.27 dB).
    • Demonstrated a fabrication-tolerant metal-insulator-semiconductor structure.
    • Showcased adaptability to various materials, including CMOS-compatible ones.

    Conclusions:

    • The demonstrated coupler enables efficient light transfer.
    • This technology is a promising building block for low-loss active plasmonic devices.
    • The fabrication tolerance and material adaptability facilitate integration into existing processes.