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Updated: Jan 25, 2026

Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
Proximity Gettering Design of Hydrocarbon⁻Molecular⁻Ion⁻Implanted Silicon Wafers Using Dark Current Spectroscopy for
Kazunari Kurita1, Takeshi Kadono2, Satoshi Shigematsu3
1SUMCO Corporation, 1-52 Kubara, Yamashiro-cho, Imari-shi, Saga 849-4256, Japan. k-kurita@sumcosi.com.
Abstract:
We developed silicon epitaxial wafers with high gettering capability by using hydrocarbon-molecular-ion implantation. These wafers also have the effect of hydrogen passivation on process-induced defects and a barrier to out-diffusion of oxygen of the Czochralski silicon (CZ) substrate bulk during Complementary metal-oxide-semiconductor (CMOS) device fabrication processes. We evaluated the electrical device performance of CMOS image sensor fabricated on this type of wafer by using dark current spectroscopy. We found fewer white spot defects compared with those of intrinsic gettering (IG) silicon wafers. We believe that these hydrocarbon-molecular-ion-implanted silicon epitaxial wafers will improve the device performance of CMOS image sensors.
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