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Network Covalent Solids

Network Covalent Solids

Network covalent solids contain a three-dimensional network of covalently bonded atoms as found in the crystal structures of nonmetals like diamond, graphite, silicon, and some covalent compounds, such as silicon dioxide (sand) and silicon carbide (carborundum, the abrasive on sandpaper). Many minerals have networks of covalent bonds.
To break or to melt a covalent network solid, covalent bonds must be broken. Because covalent bonds are relatively strong, covalent network solids are typically...

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Updated: Jan 19, 2026

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

Graphene and two-dimensional materials for silicon technology.

Deji Akinwande¹, Cedric Huyghebaert², Ching-Hua Wang³

¹Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX, USA. deji@ece.utexas.edu.

|September 27, 2019

Summary

This summary is machine-generated.

Two-dimensional (2D) materials integrated with silicon chips offer enhanced electronic device performance. This heterogeneous platform leverages 3D monolithic construction for advanced opto-electronics and sensing applications.

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Area of Science:

Materials Science
Electronics Engineering
Nanotechnology

Background:

Silicon semiconductor technology has driven electronic advancements through device miniaturization to the nanometer scale.
Graphene and other 2D materials present opportunities for atomic-limit device performance.
Combining 2D materials with silicon creates a heterogeneous platform for enhanced functionality.

Purpose of the Study:

To review the integration of atomically thin materials with silicon-based nanosystems.
To explore the opportunities, progress, and challenges in this field.
To consider prospects for computational and non-computational applications.

Main Methods:

Three-dimensional monolithic construction of multifunctional 2D silicon chips.
Exploiting vertical dimensions for enhanced performance.
Functional diversification of silicon platforms.

Main Results:

Synergistic combination of 2D materials and silicon chips enables massively enhanced potential.
3D integration allows for exploitation of vertical direction and functional diversification.
Applications in opto-electronics and sensing are facilitated.

Conclusions:

Integrating 2D materials with silicon offers a pathway to next-generation electronic devices.
Heterogeneous platforms promise significant advancements beyond traditional silicon scaling.
Further research is needed to overcome integration challenges and realize full potential.