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3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage.

Mansik Jo1, Seunghwan Bae2, Injong Oh3

  • 1Department of Electrical Engineering , Korea University , Seoul 02841 , Republic of Korea.

ACS Nano
|October 5, 2019
PubMed
Summary

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Researchers developed a 3D printing method for highly stretchable solar cells. This technique combines fused deposition modeling (FDM) with silver nanowire networks, achieving 400% system stretchability and high areal coverage for flexible energy devices.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Energy Conversion

Background:

  • Stretchability and high areal coverage are crucial for wearable electronics like photovoltaics and photodetectors.
  • Conventional 2D manufacturing of island-bridge structures faces trade-offs between stretchability and areal coverage.

Purpose of the Study:

  • To develop a 3D printing strategy for achieving extreme system stretchability and high areal coverage in flexible electronic devices.
  • To overcome the limitations of traditional 2D manufacturing and conductive filaments in fused deposition modeling (FDM).

Main Methods:

  • Utilized a 3D printer-based strategy combining fused deposition modeling (FDM) with flexible conductive nanocomposites.
  • Embedded a 2D silver nanowire percolation network onto flexible 3D printed structures.
Keywords:
3D printing encapsulationareal coveragefused deposition modelinghidden origamistretchable electronics

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  • Employed kirigami/origami-pattern-guided 3D arrangements for interconnections.

    • Main Results:

    • Achieved a perovskite solar module with ~97% initial areal coverage and 400% system stretchability.
    • Demonstrated 25,000% interconnect stretchability with electrical and mechanical reversibility over 1000 cycles.
    • The embedded silver nanowire network provided sufficient conductivity, deformability, and enhanced electrical junctions.

    Conclusions:

    • The 3D printing strategy offers a promising, low-cost, scalable, and high-speed approach for highly flexible energy conversion applications.
    • This method effectively addresses the trade-offs between stretchability and areal coverage in wearable electronic devices.
    • The kirigami/origami-guided interconnections provide efficient control over device performance under extreme deformation.