Direct PtSn Alloy Formation by Pt Electrodeposition on Sn Surface

Electrochemical deposition is a viable approach to develop novel catalyst structures, such as Pt thin films on conductive support materials. Most studies, reaching out to control electrochemical deposition of Pt to monolayer quantities focus on noble metal substrates (e.g., Au). In contrast, conductive oxides, such as antimony doped tin oxide (ATO), are considered as support material for different applications, e.g., as fuel cell catalysts. Herein, we investigate the deposition process of Pt on Sn, used as a model system for the electrochemical deposition of Pt on non-noble metal oxide supports. Doing so, we shade some light on the differences of a metallic Sn surface and surface oxide species in electrochemical deposition processes. With respect to a borate buffer solution, containing K₂PtCl₄ as Pt precursor, we report for the first time that surface oxides have the capability to fully inhibit the electrochemical deposition of Pt. Furthermore, direct alloying of the deposited Pt with the Sn support during the electrodeposition process yielded a catalyst with a high activity for the oxidation of CO.