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Additive Preparation of Conductive Circuit Based on Template Transfer Process Using a Reusable Photoresist.

Yi-Min Zhu1,2, Jie Tang1,2, Xin Jin2

  • 1Department of Material Science , Fudan University , Shanghai 200433 , People's Republic of China.

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|January 24, 2020
PubMed
Summary

A novel template transfer process enables additive manufacturing of high-performance conductive circuits. This method overcomes limitations of traditional techniques, offering improved adhesion and conductivity for flexible electronics.

Keywords:
PDMSadditive processanti-adhesionconductive circuitelectroplating

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Manufacturing Processes

Background:

  • Conventional subtractive methods for conductive circuits face challenges like pollution and high costs.
  • Existing additive processes (e.g., printing, plating) struggle with low conductivity, poor adhesion, and expense.
  • Polydimethylsiloxane (PDMS) exhibits low surface energy, hindering its adhesion with adhesives.

Purpose of the Study:

  • To develop a simple and effective template transfer process for additively preparing high-quality conductive circuits.
  • To address the limitations of existing methods, particularly concerning adhesion and conductivity.
  • To demonstrate the versatility of the process on various substrates for flexible electronics applications.

Main Methods:

  • Fabrication of a template using photolithography on copper foil with a PDMS anti-adhesion coating.
  • Metal deposition via electroplating onto the template.
  • Transfer of conductive circuits to target substrates (e.g., paper, cloth).
  • Characterization of anti-adhesion mechanism using Electrochemical Impedance Spectroscopy (EIS) and X-ray Photoelectron Spectroscopy (XPS).

Main Results:

  • Achieved copper circuits with a line width of 10 μm.
  • Demonstrated a peeling strength of 7.11 N/cm.
  • Obtained a resistivity of 1.93 μΩ·cm, comparable to bulk copper.
  • Successfully transferred circuits to diverse substrates like paper and cloth.
  • The template is reusable after re-coating with PDMS.

Conclusions:

  • The developed template transfer process offers a low-pollution, cost-effective method for additive conductive circuit fabrication.
  • The process yields circuits with excellent electrical and adhesion properties, suitable for flexible electronics.
  • This technique shows significant potential for large-scale production of devices like sensors and RFID tags.