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Enhanced Electrode Deposition for On-Chip Integrated Micro-Supercapacitors by Controlled Surface Roughening.
Agin Vyas1, Kejian Wang1, Alec Anderson2
1Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivagen 9, 41296 Gothenburg, Sweden.
ACS Omega
|March 24, 2020
Summary
This study introduces a surface roughening method to enhance the performance and yield of on-chip micro-supercapacitors (MSCs) for self-powered wireless sensors. The technique improves electrode deposition, boosting electrochemical performance and device integration in complementary metal-oxide-semiconductor (CMOS) systems.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- On-chip micro-supercapacitors (MSCs) are crucial for self-powered wireless sensor systems.
- Current MSC fabrication methods are often incompatible with semiconductor manufacturing, limiting integration.
- Spin-coating offers CMOS compatibility but faces challenges in electrochemical performance and yield.
Purpose of the Study:
- To develop a facile surface roughening technique to improve wafer yield and electrochemical performance of CMOS-compatible MSCs.
- To investigate the effect of surface modification on reduced graphene oxide electrodes for MSCs.
Main Methods:
- A 4 nm iron layer was deposited and annealed on a silicon wafer substrate to create surface roughness.
- Spin-coating was used for depositing reduced graphene oxide electrodes on both roughened and non-roughened substrates.
- Electrochemical performance, electrode thickness, mass retention, uniformity, and device yield were evaluated.
Main Results:
- Surface roughening increased electrode thickness by 78% and mass retention by 21%.
- Electrode uniformity improved by 57%, and a high device yield of 87% was achieved on a 2″ silicon substrate.
- The roughened MSCs exhibited enhanced capacitive performance, rate capability, energy, and power density.
Conclusions:
- Surface roughening is an effective strategy to enhance the performance and manufacturability of CMOS-compatible MSCs.
- This technique advances the integration of MSCs for self-powered on-chip wireless sensor electronics.
- The findings pave the way for more robust and efficient integrated energy storage solutions.
