Wood Products
Lumber
Seasoning of Wood
Thermal Insulation in Masonry Walls
Structural Properties and Dimensions of Lumber
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Production and Testing of Moisture Behavior and Thermal Properties of Rapeseed Straw and Ganoderma resinaceum Mycelium Bio-Composites
Published on: September 5, 2025
Hamid R Taghiyari1, Abolfazl Soltani2, Ayoub Esmailpour3
1Wood Science and Technology Department, Faculty of Materials Engineering & New Technologies, Shahid Rajaee Teacher Training University, Tehran 1678815811, Iran.
Adding nanoscale sepiolite to urea-formaldehyde resin in oriented strand lumber (OSL) significantly improves thermal conductivity and panel hardness. This enhancement facilitates better resin polymerization in engineered wood products.
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