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Direct-Write Printing Copper-Nickel (Cu/Ni) Alloy with Controlled Composition from a Single Electrolyte Using
Chao Wang1, Md Emran Hossain Bhuiyan1, Salvador Moreno1
1Department of Mechanical Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States.
ACS Applied Materials & Interfaces
|April 1, 2020
Summary
Researchers developed a novel co-electrodeposition method to print copper/nickel (Cu/Ni) alloys with controlled compositions. This process creates high-quality, nanocrystalline alloys suitable for functional devices like thermocouples without post-treatment.
Area of Science:
- Materials Science
- Nanotechnology
- Electrochemistry
Background:
- Existing metal printing methods are insufficient for fabricating functional devices requiring specific alloy properties.
- High-quality, crystalline alloys are crucial for the performance of devices like thermocouples and sensors.
- The demand for advanced alloy printing processes is driven by the need for functional micro- and mesoscale devices.
Purpose of the Study:
- To report a novel co-electrodeposition technique for printing single-phase solid solution nanocrystalline copper/nickel (Cu/Ni) alloys.
- To demonstrate controllable alloy compositions (Cu100Ni0 to Cu19Ni81) from a single electrolyte.
- To showcase the fabrication of a functional thermocouple using the developed printing process.
Main Methods:
- Utilized a co-electrodeposition technique to print Cu/Ni alloys.
- Employed a single electrolyte to achieve various controllable compositions.
- Characterized the printed alloy for its crystalline structure, density, and composition.
Main Results:
- Successfully printed single-phase solid solution nanocrystalline Cu/Ni alloys with compositions ranging from Cu100Ni0 to Cu19Ni81.
- The printed alloy exhibited a nanocrystalline structure (<35 nm), was continuous, dense, and non-porous.
- The material showed remarkable mechanical and magnetic properties without post-annealing, and a functional thermocouple was fabricated.
Conclusions:
- The co-electrodeposition process enables the printing of high-quality, nanocrystalline Cu/Ni alloys with tunable compositions.
- This method produces dense, defect-free alloys with excellent properties, suitable for functional device fabrication.
- The process offers a versatile platform for creating functional devices and facilitating alloy characterization studies.
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