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Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns.

Md Emran Hossain Bhuiyan1, Salvador Moreno1, Chao Wang1

  • 1Department of Mechanical Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States.

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|April 15, 2021
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Summary

This study combines confined electrodeposition (CED) with electroless plating to rapidly fabricate metallic interconnects. This novel 3D printing approach significantly accelerates processing time while maintaining high electrical and mechanical properties for electronic applications.

Keywords:
additive printing of metal filmselectroless platingelectroplatingmicroscale 3D printingthin films

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Area of Science:

  • Materials Science
  • Additive Manufacturing
  • Electrochemistry

Background:

  • Metallic interconnects are crucial for energy devices and electronics.
  • Conventional fabrication methods like photolithography are limited.
  • Confined electrodeposition (CED) offers microstructural control but is slow.

Purpose of the Study:

  • To develop a faster 3D printing method for metallic interconnects.
  • To combine CED with selective electroless plating for complex patterns.
  • To improve processing speed while maintaining material properties.

Main Methods:

  • Utilized confined electrodeposition (CED) to print seed layers.
  • Employed selected-area electroless plating for subsequent metal growth.
  • Controlled activation sites to direct metal deposition patterns.

Main Results:

  • Achieved over 100x improvement in processing time compared to CED alone.
  • Fabricated Cu and Ni films with electrical resistivity close to bulk values.
  • Demonstrated excellent mechanical properties and substrate adhesion without annealing.

Conclusions:

  • The combined CED and electroless plating process is a highly efficient method for fabricating complex metallic interconnects.
  • This technique enables rapid, high-quality metal patterning for diverse applications.
  • Potential applications include RFID tags, printed circuit boards, and sensors.