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Quantitative calculation of substrate bending caused by multilayer coating stresses.
Applied Optics
|April 1, 2020
Summary
A new method quantifies substrate bending after coating, achieving high accuracy for ion-beam sputtering and assisted deposition. This framework improves precision in thin film stress analysis.
Area of Science:
- Materials Science
- Thin Film Technology
- Surface Engineering
Background:
- Substrate bending is a critical factor in thin film deposition, affecting device performance and reliability.
- Accurate measurement of coating-induced stress and resulting substrate deformation is essential for process control.
Purpose of the Study:
- To develop a quantitative framework for calculating substrate bending after coating.
- To validate the proposed method for ion-beam sputtering and ion-beam assisted deposition processes.
Main Methods:
- Introduction of fitting parameters into a modified Stoney's formula.
- Quantitative calculation of substrate bending based on the modified formula.
Main Results:
- The proposed framework accurately calculates substrate bending.
- Achieved accuracy of less than λ/10 at 633 nm for the studied deposition processes.
Conclusions:
- The developed framework provides a reliable method for quantifying substrate bending.
- This advancement is crucial for precise control and optimization in thin film deposition techniques.
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