Biasing of Metal-Semiconductor Junctions
MOSFET: Enhancement Mode
MOSFET: Depletion Mode
Characteristics of MOSFET
MOS Capacitor
Metal-Semiconductor Junctions
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Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
Xiaorui Zheng1, Annalisa Calò1,2, Tengfei Cao3,4
1Tandon School of Engineering, New York University, 6 MetroTech Center, New York, NY, 11201, USA.
Researchers precisely controlled defects in molybdenum disulfide (MoS2) using thermochemical scanning probe lithography (tc-SPL). This technique enables on-demand p- or n-type doping for advanced electronic devices.
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