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Redeposition-Free Deep Etching in Small KY(WO₄)₂ Samples.

Simen Mikalsen Mikalsen Martinussen¹, Raimond N Frentrop¹, Meindert Dijkstra¹

¹Optical Sciences Group, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlands.

|December 1, 2020

Summary

This summary is machine-generated.

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Researchers developed a new deep etching process for potassium yttrium tungstate (KY(WO₄)₂) microchip laser fabrication. This method overcomes challenges in etching small samples, enabling reproducible waveguide creation.

Area of Science:

Materials Science
Optoelectronics
Nanofabrication

Background:

Potassium yttrium tungstate (KY(WO₄)₂) is a key material for developing on-chip laser sources.
Manufacturing integrated photonic devices requires precise deep etching of KY(WO₄)₂ on small samples.

Purpose of the Study:

To address challenges in reproducible deep etching of small KY(WO₄)₂ samples.
To develop a fabrication process for waveguides in KY(WO₄)₂ for on-chip lasers.

Main Methods:

Investigated and overcame issues including edge bead formation, lithography damage, resist reticulation during ICP-RIE, and sidewall redeposition.
Developed a deep etching process for KY(WO₄)₂, followed by a wet etch for redeposited material removal.

Keywords:

KY(WO4)2 KYW edge bead etching fabrication hard mask integrated optics redeposition reticulation tungstate

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Main Results:

Successfully etched 6.5 µm deep features in KY(WO₄)₂.
Demonstrated effective removal of redeposited material using a wet etch procedure.
Established a process enabling waveguide fabrication on ion-irradiated KY(WO₄)₂ and thin membranes.

Conclusions:

The developed deep etching and cleaning process is crucial for fabricating waveguides in KY(WO₄)₂.
This advancement facilitates the creation of integrated photonic devices, including on-chip lasers, using KY(WO₄)₂.